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XZZ L23 Kit stensil Reballing CPU untuk iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA ball Tin Platform

Category : Alat | Alat Bagian
USD 5.37USD 8.80

XZZ L23 Kit stensil Reballing CPU untuk iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA ball Tin Platform

Description
Specification
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